Conference announcement

Conference announcement

Materials Science and Engineering, 45 (1980) 296 © Elsevier Sequoia S.A., Lausanne -- Printed in the Netherlands 296 Conference Announcement May 1...

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Materials Science and Engineering, 45 (1980) 296 © Elsevier Sequoia S.A., Lausanne -- Printed in the Netherlands

296

Conference

Announcement

May 10 - 15, 1981 Symposium on the Adhesion Aspects of Polymeric Coatings, The Electrochemical Society Meeting

A symposium on the Adhesion Aspects of Polymeric Coatings will be held on May l 0 15, 1981, at The Electrochemical Society Meeting in Minneapolis, Minnesota, U.S.A. Polymeric coatings are used for a number of purposes, e.g. decorative, protective, functional (as dielectrics or insulators); a special application of polymeric (organic) coatings is their use as lithographic materials for making integrated circuit elements. Irrespective of the purpose of the coating it must adhere well to the underlying substrate. The primary purpose of this symposium is to bring out the various material and/or process parameters which influence the adhesion of polymeric coatings and the emphasis will be on polymeric coatings which are organic in nature. All sorts of polymeric coatings irrespective of their thickness (thin, thick or bulk) and method of deposition (plasma, solution, vapour etc.) on a variety of substrates (metals, oxides, glass and even polymers) will be considered. Among the topics to be covered are the following: (i) substrate cleaning, preparation and modification to modify the adhesion behaviour of

polymeric coatings; (ii) influence of the nature of the substrate material on the adhesion of polymeric coatings; (iii) material properties of polymeric coatings and their influence on adhesion; (iv) effect of deposition process parameters on adhesion; (v) understanding of interfacial interactions (i.e. mechanism of adhesion) between polymeric coatings and substrates using sophisticated techniques, e.g. electron spectroscopy for chemical analysis; (vi) techniques for adhesion measurement of polymeric coatings; (vii) effect of moisture, corrosives etc. on the durability and/or longevity of the bond; (viii) ways to make water-resistant bonds. The programme will comprise both state-of-the-art invited overviews and contributed original research papers. It is planned to chronicle the proceedings properly in a bound volume. Papers dealing with any of the above or allied topics are solicited. All inquiries should be directed to the following. Dr. K. L. Mittal (Symposium Chairman) Department 49F, Building 300-40E IBM Corporation Hopewell Junction N.Y. 12533 U.S.A. Telephone number: (914) 897-6630

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